Sputtering Materials for VLSI and Thin Film Devices, 1st Edition explosion limits 1 Polyisobutylenes

1 Polyisobutylenes

25 Brass Adhesion Mechanism

particularly in industrial sectors

Rubber components are used in many demanding applications

The Netherlands & Juergen Hackert

Sputtering Materials for VLSI and Thin Film Devices, 1st Edition explosion limits 1 PolyisobutylenesDescription Author: J Sarkar ISBN 9780815515937 Summary Key Features Unique coverage of sputtering target manufacturing methods in the light of semiconductor, displays, data storage and photovoltaic industry requirements Practical information on technology trends, role of sputtering and major OEMs Discussion on properties of a wide variety of thin films which include silicides, conductors, diffusion barriers, transparent conducting oxides, magnetic