S9S12GN16J1MLC Active Status This Agilex I FPGA SoC

This Agilex I FPGA SoC excels in high-density embedded processing applications including advanced driver assistance systems (ADAS)

876V Mounting Type Surface Mount Operating Temperature 0°C ~ 100°C (TJ) Grade - Qualification - Package / Case 484-WFBGA

and UART for comprehensive peripheral connectivity

and IoT gateway devices requiring proven Z80-compatible architecture with enhanced peripheral integration

Fully traceable and compliant with RoHS/REACH standards

S9S12GN16J1MLC Active Status This Agilex I FPGA SoCProduct attributes Property Value Manufacturer NXP USA Inc. Product Series HCS12 Packaging Marketplace Tray Core Processor S12 Core Size 16 Bit Speed 25MHz Connectivity IrDA, LINbus, SCI, SPI Peripherals LVD, POR, PWM, WDT Number of I O 26 Program Memory Size 16KB (16K x 8) Program Memory Type FLASH EEPROM Size 512 x 8 RAM Size 1K x 8 Voltage Supply (Vcc Vdd) 3. 13V ~ 5. 5V Data Converters A D 8x10b Oscillator Type Internal Operating Temperature 40C ~