AMTECH Solder Spheres Sn96.5/Ag3.0, Cu0.5 Special Sizes High boiling point engineered fluid Aqueous system (Immersion or spray)

Aqueous system (Immersion or spray)

32 M: <50% breakthrough Corrosion

designed for lead-free and tin-lead alloys

DIBP and above 0

Viscosity - Malcom @ 10 RPM/25 °C (x103mPa/s)- Sn63/Pb37 T3/T4

AMTECH Solder Spheres Sn96.5/Ag3.0, Cu0.5 Special Sizes High boiling point engineered fluid Aqueous system (Immersion or spray)Technical Data Sheet Safety Data Sheet AMTECH BGA Solder Spheres are manufactured from virgin materials to meet or exceed the requirements of building or repairing BGA packages. AMTECH spheres also exceed both IPC and MIL standards for purity levels and size tolerances. Normal sizes are from 3 mil to 35 mil and custom solder sphere sizes are available upon request. Other alloys are available upon request. Data Table Element Inspect to (% wt) Element